METHOD FOR CUTTING TOUGHENED GLASS PLATE

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United States of America Patent

SERIAL NO

14554502

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Abstract

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A method for cutting a strengthened glass sheet according to a first embodiment of the present invention includes: a step of collecting and scanning laser light in an intermediate layer, thereby forming a first reformed region along a first cutting-scheduled line; and a step of applying an external force to propagate a crack from the first reformed region as a start point in a thickness direction of the strengthened glass sheet, thereby dividing the strengthened glass sheet. In the step of forming the first reformed region, a width d1 (mm) of the first reformed region in the thickness direction is set to d1<2×103×Kc2/{π×(CT)2} based on a fracture toughness Kc (MPa·√m) of the strengthened glass sheet and the tensile stress CT (MPa) remaining in the intermediate layer.

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Patent Owner(s)

Patent OwnerAddress
ASAHI GLASS COMPANY LIMITED12-1 YURAKUCHO 1-CHOME CHIYODA-KU TOKYO 100-8405
HAMAMATSU PHOTONICS K K1126-1 ICHINO-CHO HIGASHI-KU HAMAMATSU-SHI SHIZUOKA 435-8558

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KAWAGUCHI, Daisuke Shizuoka, JP 97 368
NAGASAWA, Ikuo Tokyo, JP 17 110

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