BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE
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United States of America Patent
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Issued Date -
Mar 19, 2015
app pub date -
May 13, 2013
filing date -
May 18, 2012
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Abstract
The object of the present invention is to provide a soldering-flux-oriented novel base resin that enhances the fluidity of a soldering flux and both the visco-stability and adhesion of a solder paste, while improving the color tone and anti-crack property of the flux residue. The present invention is directed to a base resin for a soldering flux, the base resin comprising a rosin (A) containing at least 15 wt % of a pimarane-type resin acid (a-1), at least 1 wt % of a labdane-type resin acid (a-2), and at least 50 wt % of an abietane-type resin acid that has no conjugated double bond (a-3).
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