PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING
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United States of America Patent
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Issued Date -
Mar 19, 2015
app pub date -
Sep 19, 2013
filing date -
Sep 19, 2013
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Abstract
A package assembly for thin wafer shipping using force distribution plates and a method of use are disclosed. The package assembly includes a container and upper and lower force distribution plates provided within the container. The upper and lower force distribution plates are positioned respectively on a top side and bottom side of the container.
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