INTEGRATED LOOP STRUCTURE FOR RADIO FREQUENCY IDENTIFICATION
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United States of America Patent
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Issued Date -
Mar 19, 2015
app pub date -
Apr 11, 2013
filing date -
Apr 19, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An assembly for a radio frequency (RF) communication circuit includes an electrically insulating substrate having a first side and a second side. A first electrically conductive structure is arranged on the first side of the substrate. The first electrically conductive structure has the structure of a split loop that has a first end and a second end. The RF communication circuit is arranged to be attached to a site for the RF communication circuit between the first end and the second end. The assembly also includes a second electrically conductive structure arranged on the second side of the substrate. The second electrically conductive structure is arranged with respect to the first electrically conductive structure in such a manner that the site for the RF communication circuit overlaps the second electrically conductive structure in order to increase the capacitance of the assembly for the RF communication circuit.
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