SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF

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United States of America Patent

SERIAL NO

14547354

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Abstract

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A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 5678680 ?5678680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KATAYAMA, Hiroyuki Osaka, JP 227 1743
NAKANISHI, Sadahiro Osaka, JP 29 119
ONA, Haruka Osaka, JP 11 15

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