LEADFRAME PACKAGE WITH WETTABLE SIDES AND METHOD OF MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Mar 19, 2015
app pub date -
Sep 16, 2013
filing date -
Sep 16, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Embodiments of the present disclosure are directed to leadframe packages with wettable sides and methods of manufacturing same. In one embodiment, the leads of the leadframe packages have recesses with a curved profile formed therein. The recesses are plated with a solder wettable layer of conductive material that enables solder to flow along the surface during surface mounting of the package to a board, such as a PCB.
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