Semiconductor device
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United States of America Patent
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-
Nov 24, 2015
Grant Date -
Mar 19, 2015
app pub date -
Mar 13, 2014
filing date -
Sep 18, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a first contact plug, a diametric dimension of an upper end portion thereof greater than the lower end portion thereof; a first insulating film above a substrate and covering the first plug; a second contact plug, a diametric dimension of an upper end portion thereof less than lower end portion thereof, the lower end portion contacting the upper end portion of the first plug; a second insulating film above the first insulating film and the first plug and covering the second plug; a wiring layer including a lower end portion contacting the upper end portion of the second plug; and a third insulating film above the second insulating film and the second plug and covering the wiring layer; wherein the upper end portion of the first plug displaced from the lower end portion of the second plug has a step.
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