Three-dimensional chip stack for self-powered integrated circuit

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United States of America Patent

PATENT NO 9230940
APP PUB NO 20150077173A1
SERIAL NO

14026597

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Abstract

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Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goodnow, Kenneth J Essex Junction, US 111 1169
Leonard, Todd E Williston, US 33 264
Shuma, Stephen G Underhill, US 53 285
Twombly, Peter A Shelburne, US 34 305

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