Semiconductor device having stacked chips

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United States of America Patent

PATENT NO 9431322
SERIAL NO

14552177

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Abstract

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According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATIONTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koyanagi, Masaru Tokyo, JP 139 848

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