BONDED FLUID HEAT EXCHANGING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

14494232

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Abstract

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A heat exchanging apparatus has a flow path with air tightness formed by joining a second sheet to a first sheet formed by bending the first sheet by stamping and fluid introduced into the flow path impinges on a wall of the flow path to perform heat exchange. A material constituting the flow path may be a metal sheet or an electrically-conductive plastic, and a small-sized and light-weight heat exchanging apparatus can be manufactured at a low cost.

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Patent Owner(s)

Patent OwnerAddress
PHILTECH INC5F YUSHIMA OHTA BLDG 2-29-3 YUSHIMA BUNKYO-KU TOKYO 113-0034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FURUMURA, Yuji Kanagawa, JP 42 1037
MURA, Naomi Tokyo, JP 16 222
NISHIHARA, Shinji Tokyo, JP 55 778
SHIMIZU, Noriyoshi Tokyo, JP 139 1576

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