Chip joining by induction heating

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9776270
SERIAL NO

14043047

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ayotte, Stephen P Bristol, US 35 153
Richard, Glen E Essex Junction, US 16 87
Sullivan, Timothy D Underhill, US 138 1680
Sullivan, Timothy M Essex Junction, US 45 325

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