SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20150090297A1
SERIAL NO

14495314

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Abstract

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A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

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Patent Owner(s)

Patent OwnerAddress
SHIBAURA MECHATRONICS CORPORATION5-1 KASAMA 2-CHOME SAKAE-KU YOKOHAMA-SHI KANAGAWA 247-8610

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAYASHI, Konosuke Yokohama-shi, JP 29 113
MATSUSHITA, Jun Yokohama-shi, JP 9 28
MIYAZAKI, Kunihiro Yokohama-shi, JP 56 592
NAGASHIMA, Yuji Yokohama-shi, JP 31 726

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