SUPPORT PLATEHEAT DISSIPATION APPARATUS
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United States of America Patent
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Oct 28, 2014
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Sep 29, 2013
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Abstract
Embodiments of the present invention relate to a heat dissipation apparatus and relates to the field of heat dissipation technologies, so as to solve a problem that heat dissipation efficiency of heat dissipation fins of an existing heat dissipation apparatus is low. In embodiments of the present invention, the heat dissipation apparatus includes a base plate, where multiple main fins are disposed on the base plate, and multiple auxiliary fins are disposed on the main fins; a gap exists between the auxiliary fins and the base plate; and a blocking structure is disposed and fastened on the base plate and/or the main fins, and the blocking structure can make cooling airflow first flow along the auxiliary fins and then flow along gaps between adjacent main fins and flow out. The present invention is mainly used in the field of communication accessories.
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