CURABLE COMPOSITION FOR PRINTED CIRCUIT BOARD, CURED COATING FILM USING THE SAME, AND PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Apr 2, 2015
app pub date -
Sep 30, 2014
filing date -
Sep 30, 2013
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Abstract
Provided are: a curable composition which can attain both good adhesion to a printed circuit board, particularly to a flexible substrate or the like; a resist coating film of the curable composition; and a printed circuit board comprising a resist pattern formed by the curable composition.
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