Semiconductor device and fabricating method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9287270
APP PUB NO 20150091069A1
SERIAL NO

14279301

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Abstract

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Provided are a semiconductor device and a fabricating method thereof. The semiconductor device includes a storage electrode having a cylinder shape, a dielectric film formed on the storage electrode, and a plate electrode formed on the dielectric film, wherein the plate electrode includes a first semiconductor compound layer and a second semiconductor compound layer sequentially stacked one on the other, and the first semiconductor compound layer has a crystallinity different from that of the second semiconductor compound layer.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Im, Ki-Vin Seongnam-si, KR 50 1323
Kim, Hyun-Jun Seoul, KR 71 722
Lim, Han-Jin Seoul, KR 51 397
Oh, Jung-Hwan Yongin-si, KR 34 751
Seo, Jong-Bom Seoul, KR 17 70

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