Metrology tool for electroless copper thickness measurement for BBUL process development monitoring

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United States of America Patent

PATENT NO 9441952
APP PUB NO 20150092201A1
SERIAL NO

14040178

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Abstract

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A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yu-Chun Chandler, US 85 174
Ghosh, Nilanjan Chandler, US 5 9
Liu, Shuhong Chandler, US 9 74
Wang, Zhiyong Chandler, US 184 706

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