Importance

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Abstract

Ultra-capacitor structures and electronic systems and assemblies are provided. In one aspect, the ultra-capacitor structure is configured to selectively power and at least partially house electronic component(s) therein. In one embodiment, the ultra-capacitor structure includes a thermally conductive material facilitating dissipation of heat generated. In another embodiment, the ultra-capacitor structure includes an electrically conductive sheet facilitating electromagnetic shielding. In another aspect, an electronic system includes: an electronic device including electronic component(s); and a support structure physically receiving and electrically coupling to the electronic device, and including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic device when electrically coupled to the support structure. In another aspect, an electronic assembly has a first region including electronic component(s), and a second region including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic assembly, where the first region is spaced apart from the second region.

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First Claim