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Abstract

There is provided a semiconductor laser module with a semiconductor laser chip, in which a first optical waveguide is formed, flip-chip mounted on a silicon substrate with a mesa structure in which a second optical waveguide is formed. The optical axes of the first optical waveguide and the second optical waveguide make a specified angle with lines perpendicular to the respective cleavage planes. Alignment marks are provided on the silicon substrate and the semiconductor laser chip at at least two positioning locations to enable mounting of the semiconductor laser chip by passive alignment. The mounting position is decided so that laser light emitted in a direction of the optical axis of the first optical waveguide and refracted at the emission surface, is refracted at the incident surface of the second optical waveguide and becomes incident in the direction of the optical axis of the second optical waveguide.

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First Claim