Polyisobutylene-Based Encapsulant for use with Electronic Components
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United States of America Patent
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Issued Date -
Apr 2, 2015
app pub date -
Sep 27, 2013
filing date -
Sep 27, 2013
priority date (Note) -
Abandoned
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Abstract
An encapsulant for use with electronic components. The encapsulant includes a polyisobutylene, a tackifier, a polymer, and a thermoplastic elastomer. In one example, the encapsulant is applied to an electronic component at a temperature ranging from about 100° C. to about 150° C. to provide a moisture barrier when the encapsulant cools.
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