Exposure activated chemically amplified directed self-assembly (DSA) for back end of line (BEOL) pattern cutting and plugging

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United States of America Patent

PATENT NO 9625815
SERIAL NO

14039140

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Abstract

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Self-aligned via and plug patterning for back end of line (BEOL) interconnects are described. In an example, a structure for directed self-assembly includes a substrate and a block co-polymer structure disposed above the substrate. The block co-polymer structure has a polystyrene (PS) component and a polymethyl methacrylate (PMMA) component. One of the PS component or the PMMA component is photosensitive.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Eungnak Beaverton, US 43 213
Nyhus, Paul A Portland, US 45 547
Putna, Ernisse S Portland, US 11 516
Sivakumar, Swaminathan Beaverton, US 85 661

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