WAFER PROCESSING METHOD
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United States of America Patent
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Issued Date -
Apr 2, 2015
app pub date -
Sep 17, 2014
filing date -
Oct 2, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer processing method of processing a wafer having a plurality of devices formed on the front side of the wafer, the devices being respectively formed in a plurality of separate regions defined by a plurality of crossing division lines. The wafer processing method includes a support member providing step of providing a support member on the back side of the wafer, the support member having substantially the same size as that of the wafer, and a dividing step of dicing the wafer from the front side thereof along the division lines after performing the support member providing step, thereby dividing the wafer into a plurality of chips.
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