Structures for bonding a direct-bandgap chip to a silicon photonic device

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United States of America Patent

PATENT NO 9882073
SERIAL NO

14509979

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Abstract

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A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.

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Patent Owner(s)

  • SKORPIOS TECHNOLOGIES, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Creazzo, Timothy Albuquerque, US 30 441
Dallesasse, John Geneva, US 47 1711
Krasulick, Stephen B Albuquerque, US 75 1820
Marchena, Elton Albuquerque, US 25 439
Mizrahi, Amit Albuquerque, US 35 395
Spann, John Y Albuquerque, US 11 188

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