Hermetic conductive feedthroughs for a semiconductor wafer

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United States of America Patent

PATENT NO 10464836
APP PUB NO 20150101841A1
SERIAL NO

14050415

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Abstract

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A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

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Patent Owner(s)

  • MEDTRONIC INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ruben, David A Mesa, US 79 1787
Sandlin, Michael S Chandler, US 14 171

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