Microelectromechanical device with protection for bonding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10239748
APP PUB NO 20150102434A1
SERIAL NO

14511002

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Conti, Sebastiano Mistretta, IT 39 550
Maggi, Luca Garlate, IT 20 102

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 26, 2026
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 26, 2030
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00