Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems
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United States of America Patent
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Apr 16, 2015
app pub date -
Oct 10, 2013
filing date -
Oct 10, 2013
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Abstract
A fully additive method for forming multilayer electrical interconnects for printed electronic and/or optoelectronic devices is disclosed. Electrical interconnects are fabricated by directly ink-jet printing a dielectric material with selective interconnection holes, and then ink jet printing conductive patterns and filling the interconnection holes with conductive material to form multilayer interconnects. A method for manufacturing a multilayer printed electronic system utilizing the invention is also disclosed. Other embodiments are described and claimed.
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