Bumpless build-up layer package including an integrated heat spreader
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United States of America Patent
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Oct 6, 2015
Grant Date -
Apr 16, 2015
app pub date -
Dec 15, 2014
filing date -
Sep 28, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower heat spreader surface, an upper heat spreader surface parallel to the lower heat spreader surface, and at least one heat spreader side, the heat spreader disposed on the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the heat spreader side and lower heat spreader surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.
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