PLASMA TREATMENT APPARATUS AND SUBSTRATE TREATMENT SYSTEM

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United States of America Patent

SERIAL NO

14501300

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a substrate treatment system including multiple treatment chambers around a substrate transfer chamber, an increase in apparatus floor area due to installation of additional treatment chambers is reduced. A plasma treatment apparatus according to one embodiment of the present invention includes: a treatment chamber; a substrate holder for holding the substrate; plasma generation unit for forming plasma; multiple gate valves for installation and removal of the substrate; a shield for surrounding the plasma formed by the plasma generation unit; and substrate transfer unit for transferring the substrate through the gate valves. The substrate transfer unit is shielded from the plasma by the shield.

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Patent Owner(s)

Patent OwnerAddress
CANON ANELVA CORPORATION2-5-1 KURIGI ASAO-KU KAWASAKI-SHI KANAGAWA-KEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAGAMINE, Yoshinori Kawasaki-shi, JP 26 437
NAKAJIMA, Daisuke Kawasaki-shi, JP 109 351
TSUNEKAWA, Koji Kawasaki-shi, JP 53 563

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