PROCESS FOR PRODUCING ADHESIVE SHEET HAVING SINGULATED ADHESIVE LAYER, PROCESS FOR PRODUCING WIRING SUBSTRATE USING THE ADHESIVE SHEET, METHOD OF MANUFACTURING SEMICONDUCTOR EQUIPMENT, AND EQUIPMENT FOR PRODUCING ADHESIVE SHEET
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United States of America Patent
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Issued Date -
Apr 23, 2015
app pub date -
Jun 26, 2013
filing date -
Jul 3, 2012
priority date (Note) -
Abandoned
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Abstract
Provided is a process for producing an adhesive sheet having a singulated adhesive layer (b) on a carrier film (a), comprising the following steps in the order mentioned:
- Step A: cutting an adhesive film having a carrier film (a), an adhesive layer (b), and a cover film (c) in the order mentioned locally only at the adhesive layer (b) and the cover film (c) by means of local half-cutting;Step B: peeling only the cover film (c) at unwanted parts of the adhesive film;Step C: applying adhesive tape to the side of the cover film (c) of the adhesive film; andStep D: peeling the adhesive layer (b) at unwanted parts and the cover film (c) at desired parts of the adhesive film together with the adhesive tape.
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