Electronic chip with means of protecting its back face
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United States of America Patent
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Jan 5, 2016
Grant Date -
Apr 23, 2015
app pub date -
Oct 9, 2014
filing date -
Oct 22, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic chip is provided, including an electronic circuit located at a front face of a substrate; a capacitive element placed at a back face of the substrate and facing the electronic circuit, and electrically connected to the electronic circuit by a first electrical connection and a second electrical connection, the first electrical connection including at least a first electrically conducting via passing through the substrate, the electronic circuit being configured to measure a value of electrical capacitance of the capacitive element between the first and the second electrical connections; and a plurality of second vias or trenches passing through the back face of the substrate and a part of the thickness of the substrate, and extending toward the electronic circuit such that bottom walls of the plurality of second vias or trenches are separated from the electronic circuit by at least one non-zero distance.
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