Lapping head with a sensor device on the rotating lapping head
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United States of America Patent
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Apr 12, 2016
Grant Date -
Apr 23, 2015
app pub date -
Oct 18, 2013
filing date -
Oct 18, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.
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