HOT MELT ADHESIVE
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United States of America Patent
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app pub date -
Dec 29, 2014
filing date -
Jun 28, 2012
priority date (Note) -
Abandoned
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Abstract
Disclosed is a hot melt adhesive comprising: (A) a copolymer of ethylene/olefin having 3-20 carbons; and (B) a polyester polyol. The hot melt adhesive can be applied at low temperature and has a suitably long open time. Particularly, the hot melt adhesive is excellent in adhesion to a paper and is useful as a hot melt adhesive for papers.
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