Bond Model For Representing Heterogeneous Material In Discrete Element Method
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United States of America Patent
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Issued Date -
Apr 23, 2015
app pub date -
Dec 10, 2013
filing date -
Oct 18, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A bond model in DEM is disclosed. The model includes receiving initial location, volume, mass density, bulk shear moduli of discrete particles representing physical domain made of heterogeneous material; assigning an influence range to each discrete particle; establishing a plurality of bonds for connecting the discrete particles, each of the bonds is divided into first and second sub-bonds with the first sub-bond connecting to a first discrete particle and the second sub-bond connecting to a second discrete particle, the said first and second discrete particles are located within the influence range. Each discrete particle is connected to one or more sub-bonds; dividing the volume of each discrete particle into one or more sub-bonds so that one or more sub-bonds are assigned with properties that include length and cross-section area; and obtaining numerically simulated physical phenomena within the physical domain by conducting a time-marching simulation of the bonds with assigned properties.
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