SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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N/A
Issued Date -
Apr 30, 2015
app pub date -
Dec 13, 2013
filing date -
Oct 30, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A substrate structure includes a substrate and a filling material. The substrate has an upper surface, a lower surface, at least one first blind via and at least one second blind via. The substrate includes an insulation layer, a first copper foil layer and a second copper foil layer. The first copper foil layer and the second copper foil layer are respectively disposed on two opposite side surfaces of the insulation layer. The first blind via extends from the upper surface toward the second copper foil layer and exposes a portion of the second copper foil layer. The second blind via extends from the lower surface toward the first copper foil layer and exposes a portion of the first copper foil layer. The filling material is filled inside of the first blind via and the second blind via and covers the upper surface and the lower surface of the substrate.
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