Method for manufacturing a die assembly having a small thickness and die assembly relating thereto

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United States of America Patent

PATENT NO 9327964
SERIAL NO

14524661

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Abstract

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A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Allegato, Giorgio Monza, IT 27 43
Corso, Lorenzo Ruginello, IT 19 25
Ferrera, Marco Concorezzo, IT 44 288
Garavaglia, Matteo Magenta, IT 7 13

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