SEMICONDUCOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Apr 30, 2015
app pub date -
Aug 1, 2014
filing date -
Oct 25, 2013
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a method of making a semiconductor device having a chip embedded in a heat spreader and electrically connected to a hybrid substrate. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a heat spreader using an adhesive with the chip inserted into a cavity of the heat spreader. The heat spreader provides thermal dissipation and the interposer provides a CTE-matched interface and primary fan-out routing for the chip.
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