Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10045463
APP PUB NO 20150116941A1
SERIAL NO

14562867

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Abstract

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Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

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Patent Owner(s)

  • IBM CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chainer, Timothy J Putnam Valley, US 129 2364
Graybill, David P Staatsburg, US 39 834
Iyengar, Madhusudan K Foster City, US 329 12647
Kamath, Vinod Raleigh, US 83 2221
Kochuparambil, Bejoy J Apex, US 22 387
Schmidt, Roger R Pougkeepsie, US 272 10641
Steinke, Mark E Durham, US 52 1093

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