High Performance Thermal Interface System With Improved Heat Spreading and CTE Compliance
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United States of America Patent
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Issued Date -
Apr 30, 2015
app pub date -
Oct 30, 2013
filing date -
Oct 30, 2013
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Abandoned
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Abstract
A method of thermal interface material (TIM) assembly includes plating a seed layer on each of a plurality of graphite film layers, each of the graphite film layers comprising parallel-oriented graphite nanoplates, stacking the plurality of graphite film layers, each of the plurality of graphite film layers separated by at least one solder layer, pressing together the stacked graphite film layers, and applying heat to the plurality of graphite film layers and respective at least one solder layer in a vacuumed furnace to form a graphite laminate.
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