Semiconductor package including a plurality of chips

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9490237
APP PUB NO 20150123275A1
SERIAL NO

14593773

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Abstract

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A reconfigured wafer of resin-encapsulated semiconductor packages is obtained by supporting with a resin, thereafter, a grinding process is performed on top and backside surfaces to expose only a bump interconnection electrode on a surface of a semiconductor chip. Further, a chip-scale package is obtained by a dicing process along a periphery of the chip.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iida, Atsuko Kanagawa, JP 45 262
Itaya, Kazuhiko Kanagawa, JP 83 1989
Onozuka, Yutaka Kanagawa, JP 45 494
Yamada, Hiroshi Kanagawa, JP 691 7950

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