Electronic module having an interconnection substrate with a buried electronic device therein

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United States of America Patent

PATENT NO 9634641
SERIAL NO

14524857

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Abstract

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An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.

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Patent Owner(s)

  • TAIYO YUDEN CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuroyanagi, Takuma Tokyo, JP 27 136
Nishimura, Gohki Tokyo, JP 7 65
Tanaka, Sachiko Tokyo, JP 11 89
Tasaka, Naoyuki Tokyo, JP 10 94

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