Forming conductive metal patterns with reactive polymers
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United States of America Patent
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Sep 8, 2015
Grant Date -
May 7, 2015
app pub date -
Nov 5, 2013
filing date -
Nov 5, 2013
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Abstract
A pattern is formed in a polymeric layer comprising a reactive composition that comprises: (a) a polymer comprising pendant -arylene-X—C(═O)—O— t-alkyl groups that comprise a blocking group that is cleavable to provide pendant -arylene-XH groups, (b) a compound that provides a cleaving acid upon exposure to radiation having a λmax of 150 nm and to 450 nm, which cleaving acid has a pKa of 2 or less as measured in water, and (c) optionally, a photosensitizer. The polymeric layer is imagewise exposed to suitable radiation to provide non-exposed regions and exposed regions comprising a de-blocked and crosslinked polymer with pendant -arylene-XH groups. The exposed regions are contacted with electroless seed metal ions in the de-blocked and crosslinked polymer. After reduction, the corresponding electroless seed metal nuclei are electrolessly plated using a suitable metal that is the same as or different from the corresponding electroless seed metal nuclei.
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