SYSTEMS AND METHODS FOR ULTRASONICALLY CLEAVING A BONDED WAFER PAIR
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United States of America Patent
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Issued Date -
May 7, 2015
app pub date -
Jan 15, 2015
filing date -
Mar 28, 2011
priority date (Note) -
Abandoned
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Abstract
Methods for the ultrasonic cleaving of bonded wafer pairs include positioning the bonded wafer pair in a wafer holder disposed in a tank containing a volume of liquid and ultrasonically agitating the volume of liquid in the tank with an ultrasonic agitator. The ultrasonic agitation of the volume of liquid cleaves the bonded wafer pair into a handle wafer and a silicon-on-insulator wafer.
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