Hot-Melt Adhesive Composition Having Low Viscosity
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United States of America Patent
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Issued Date -
May 7, 2015
app pub date -
May 2, 2013
filing date -
May 4, 2012
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Abandoned
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Abstract
Provided is a hot-melt adhesive composition having a low viscosity, and more particularly, a hot-melt adhesive composition having a low viscosity, capable of being easily used at a low temperature by adding a viscosity lowering agent to a hot-melt adhesive composition containing an aliphatic polycarbonate obtained by copolymerization of carbon dioxide and one or more epoxide compounds to lower a viscosity while maintaining normal adhesive force.
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