Shaped internal leads for a printed circuit substrate

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United States of America Patent

PATENT NO 9288905
APP PUB NO 20150129284A1
SERIAL NO

14076667

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Abstract

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A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead.

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Patent Owner(s)

  • SEAGATE TECHNOLOGY LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aparimarn, Prapan Bangkok, TH 5 16
Bamrungwongtaree, Joompondej Bangna Bangna, TH 5 13
Chiyatan, Chaovalit Bangkok, TH 1 4
Jirawattanakasem, Piriyakorn Samutprakarn, TH 3 8

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