Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device
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United States of America Patent
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Oct 4, 2016
Grant Date -
May 14, 2015
app pub date -
Nov 13, 2014
filing date -
Nov 13, 2013
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor chip according to an embodiment includes forming on a semiconductor substrate a plurality of etching masks each including a protection film to demarcate a plurality of first regions of the substrate protected by the plurality of etching masks and a second region as an exposed region of the substrate, and anisotropically removing the second region by a chemical etching process to form a plurality of grooves each including a side wall at least partially located in the same plane as an end face of the etching mask and a bottom portion reaching a back surface of the substrate, thereby singulating the semiconductor substrate into a plurality of chip main bodies corresponding to the plurality of first regions.
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