Liquid cooling of multiple components on a circuit board
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United States of America Patent
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Apr 12, 2016
Grant Date -
May 14, 2015
app pub date -
Nov 12, 2013
filing date -
Nov 12, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.
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