HEAT DISSIPATION DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150136364A1
SERIAL NO

14153096

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipation device includes a package carrier, heat dissipating fins, an atomizer and a driving unit. The package carrier has a carrying surface and a disposing surface divided into a first region and a second region. The heat dissipating fines are located in the second region and define an accommodating space with the package carrier. An extending direction of the heat dissipating fines is perpendicular to an extending direction of the package carrier. The atomizer is disposed on the heat dissipating fines and located in the accommodating space. The atomizer includes an atomization unit, a liquid containing cavity and a fluid channel. The liquid containing cavity, the heat dissipating fines and the package carrier define a fluid chamber. The driving unit is electrically connected to the atomizer so as to drive a working fluid to the atomization unit and atomize the working fluid into an atomization micro-mist.

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Patent Owner(s)

Patent OwnerAddress
SUBTRON TECHNOLOGY CO LTDNO 8 GUANGFU N RD SCIENCE-BASED INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY 303

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chuang, Chih-Hong Hsinchu County, TW 10 36

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