MULTILAYERED WIRING SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150136449A1
SERIAL NO

14538455

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

[Objective] To provide a multilayer wiring substrate in which, even when a core substrate is thinned, the core substrate can reliably accommodate a capacitor.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
NGK SPARK PLUG CO LTDNAGOYA-SHI AICHI-KEN 467-8525

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
INOUE, Masahiro Kounan-shi, JP 268 3109
KOBAYASHI, Teruyuki Kani-shi, JP 13 147
TORII, Takuya Komaki-shi, JP 5 35
YAMASHITA, Daisuke Chino-shi, JP 133 1062

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation