MULTILAYERED WIRING SUBSTRATE

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United States of America Patent

APP PUB NO 20150136449A1
SERIAL NO

14538455

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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[Objective] To provide a multilayer wiring substrate in which, even when a core substrate is thinned, the core substrate can reliably accommodate a capacitor.

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Patent Owner(s)

Patent OwnerAddress
NGK SPARK PLUG CO LTDNAGOYA PREFECTURE AICHI PREFECTURE JAPAN NAGOYA CITY AICHI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
INOUE, Masahiro Kounan-shi, JP 264 2992
KOBAYASHI, Teruyuki Kani-shi, JP 13 143
TORII, Takuya Komaki-shi, JP 5 31
YAMASHITA, Daisuke Chino-shi, JP 131 938

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