Substrate Treating Apparatus and Method
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United States of America Patent
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Issued Date -
May 21, 2015
app pub date -
Nov 14, 2014
filing date -
Nov 15, 2013
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Abstract
Provided is a substrate treating apparatus including a first supplying unit, a second supplying unit, a first source, a second source, a gas separation member or the like. Plasma generated from a first gas supplied from a first supplying unit by the first source is used for treating a central area of a substrate. Plasma generated from a second gas supplied from a second supplying unit by the second source is used for treating an edge area of the substrate. A gas separation member prevents plasmas generated respectively from first and second gases from being mixed up.
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