Coil Arrangement with Metal Filling

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United States of America Patent

APP PUB NO 20150137313A1
SERIAL NO

14534311

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Devices, methods and production devices that relate to the forming of a coil on a semiconductor substrate are provided. Arranged within the coil is a metal filling, for example with a density of less than 20%.

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Patent Owner(s)

Patent OwnerAddress
MAXLINEAR INC5966 LA PLACE CT #100 CARLSBAD CA 92008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Marak, Arnold Villach, AT 2 0
Tschuden, Bernhard Villach, AT 1 0

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